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基于PG網(wǎng)絡(luò)的全流程優(yōu)化在高性能CPU內(nèi)核中的應(yīng)用
2023年電子技術(shù)應(yīng)用第8期
姜姝,楊超,吳馳
(上海云豹?jiǎng)?chuàng)芯智能科技有限公司,上海 201210)
摘要: 隨著高性能計(jì)算芯片的集成度不斷提高以及工藝的進(jìn)步, 金屬連線的寬度越來(lái)越窄,芯片電源網(wǎng)絡(luò)上電阻增加和高密度的邏輯門(mén)單元同時(shí)有邏輯翻轉(zhuǎn)動(dòng)作時(shí)會(huì)在電源網(wǎng)絡(luò)上產(chǎn)生電壓降(IR Drop),導(dǎo)致芯片產(chǎn)生時(shí)序問(wèn)題,甚至可能發(fā)生邏輯門(mén)的功能故障。
中圖分類(lèi)號(hào):TN402 文獻(xiàn)標(biāo)志碼:A DOI: 10.16157/j.issn.0258-7998.239807
中文引用格式: 姜姝,楊超,吳馳. 基于PG網(wǎng)絡(luò)的全流程優(yōu)化在高性能CPU內(nèi)核中的應(yīng)用[J]. 電子技術(shù)應(yīng)用,2023,49(8):36-41.
英文引用格式: Jiang Shu,Yang Chao,Wu Chi. Application of fully automated optimization based on PG network in high performance CPU core[J]. Application of Electronic Technique,2023,49(8):36-41.
Application of fully automated optimization based on PG network in high performance CPU core
Jiang Shu,Yang Chao,Wu Chi
(Jaguar Microsystems, Shanghai 201210, China)
Abstract: With the continuous improvement of the integration of high-performance computing chips and the advancement of technology, the width of metal wires is getting narrower and narrower, and the voltage drop (IR drop) will occur on the power network when the resistance on the chip power network increases and the high-density logic gate unit has a logic flip action at the same time, resulting in timing problems in the chip, and even the functional failure of the logic gate may occur. Based on the flash PG flow of the Cadence implementation tool Innovus, this paper completes the comprehensive implementation and rapid iteration of the PG network, and uses auto reinforce PG and trim PG to realize the trade-off between the voltage drop and timing of the high-performance CPU core from two aspects, and completes the whole process optimization of the PG network from floorplan to PR (Placement and Route) stage. The results show that under the premise of the same machine resources, flash PG flow can increase the speed of powerplan up to 10 times the original, especially in the design of the top level, which can effectively save the exploration time of PG mesh in the early stage of design. Auto reinforce PG and trim PG repair 66% of the dynamic IR drop violations by reinforcing the PG of the weak IR area and trimming the redundant PG respectively, and at the same time provide more winding resources for the design to achieve the purpose of not deteriorating the timing and DRC (Design Rule Check).
Key words : chip design;flasg PG;IR drop fixing

0 引言

隨著高性能計(jì)算芯片的集成度不斷提高以及工藝的進(jìn)步,加上邏輯電路與電源網(wǎng)絡(luò)的復(fù)雜程度也越來(lái)越高,芯片中某些區(qū)域會(huì)出現(xiàn)局部電流較大的現(xiàn)象,使得所在區(qū)域電壓降 (IR Drop)增大,導(dǎo)致邏輯單元上的實(shí)際工作電壓低于理想工作電壓,導(dǎo)致芯片產(chǎn)生時(shí)序問(wèn)題,甚至可能發(fā)生邏輯門(mén)的功能故障[1-4]。本文基于Cadence實(shí)現(xiàn)工具Innovus的flash PG flow完成對(duì)于PG 網(wǎng)絡(luò)的綜合實(shí)現(xiàn)與快速迭代,并利用 auto reinforce PG和trim PG從兩方面實(shí)現(xiàn)了對(duì)高性能CPU核的電壓降與時(shí)序之間的trade-off,完成從布圖規(guī)劃(floorplan)階段到PR(Placement and Route)階段針對(duì)PG網(wǎng)絡(luò)的流程優(yōu)化。



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作者信息:

姜姝,楊超,吳馳

(上海云豹?jiǎng)?chuàng)芯智能科技有限公司,上海 201210)


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