中圖分類號：TP273+.3；TN967.2 文獻標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.245991 中文引用格式： 沈時俊，何一蕾，汪金華，等. 組合導(dǎo)航微系統(tǒng)陶瓷基三維集成技術(shù)[J]. 電子技術(shù)應(yīng)用，2025，51(4)：101-105. 英文引用格式： Shen Shijun，He Yilei，Wang Jinhua，et al. Ceramic based 3D integration technology of integrated navigation microsystem[J]. Application of Electronic Technique，2025，51(4)：101-105.
Ceramic based 3D integration technology of integrated navigation microsystem
Shen Shijun，He Yilei，Wang Jinhua，Zhuang Yonghe
Anhui Province Key Laboratory of Microsystem， The 43rd Research Institute of China Electronics Technology Group Corporation
Abstract： In order to solve the problem of large volume and weight of high-precision integrated navigation system, a new 3D micro system packaging structure is proposed based on System in Package(SiP) technology such as multi-layer ceramic substrate, high-density wiring and 3D assembly. Using SIP processes such as Low Temperature Cofired Ceramic(LTCC) substrate high-density wiring and mounting, substrate stacking and high orthogonal assembly, the triaxial accelerometer, triaxial gyroscope, satellite navigation, geomagnetic meter and barometric altimeter are integrated into one packaging unit. The overall size of the integrated navigation microsystem product is only 3.1 cm×2.9 cm×0.96 cm, and the weighing is only 18 grams, and greatly expanded the application field. Through data fusion algorithms, navigation accuracy and reliability can be effectively improved, presenting broad application prospects.
Key words : integrated navigation microsystem；System in Package（SiP）；3D assembly；Low Temperature Cofired Ceramic（LTCC）
